The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Mar. 30, 2022
Applicant:

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Qing Cao, Shanghai, CN;

Shenglan Zhang, Shanghai, CN;

Chao Ma, Shanghai, CN;

Assignee:

Dow Silicones Corpo ation, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 83/08 (2006.01); C08G 77/00 (2006.01); C08G 77/12 (2006.01); C08G 77/16 (2006.01); C08G 77/20 (2006.01); C09J 7/38 (2018.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
C08L 83/08 (2013.01); C08G 77/12 (2013.01); C08G 77/16 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01); C09J 7/381 (2018.01); C09J 183/04 (2013.01); C08L 2205/025 (2013.01);
Abstract

A curable composition contains: (A) a polydiorganosiloxane component including: (A1) greater than 3.1 wt % to 20 wt % of an aliphatically unsaturated polydiorganosiloxane polymer and (A3) a hydroxyl-terminated polydiorganosiloxane gum of unit formula (A-III); (B) a polyorganosilicate resin component including (B1) a capped resin, (B2) >18.53 wt % to 54.3 wt % of an uncapped resin; where the weight ratio of the uncapped resin (B2) to the capped resin (B1) is greater than 0.51 to 58.82; where component (A) and component (B) are present in amounts to provide a weight ratio of (B):(A) of 1.2:1 to less than 1.62:1; (C) a polyorganohydrogensiloxane that is present in an amount to provide a molar ratio of silicon bonded hydrogen atoms to alkenyl groups for the curable composition of 5 to 50; (D) a hydrosilylation reaction catalyst in an amount sufficient to provide 1 to 1000 ppm of platinum group metal; and (E) a condensation reaction catalyst; where the content of alkenyl groups in the curable composition is 0.017 wt % to 0.089 wt %; and where wt % values are relative to the total weight of components (A), (B), (C), (D) and (E) unless otherwise stated.


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