The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Apr. 09, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Changbo Shim, Daejeon, KR;
Hyunsung Min, Daejeon, KR;
Hee Yong Shim, Daejeon, KR;
Hwayeon Moon, Daejeon, KR;
Seunghyun Song, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/56 (2006.01); B32B 5/26 (2006.01); B32B 7/027 (2019.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/38 (2006.01); C08G 59/68 (2006.01); C08G 73/12 (2006.01); C08J 5/24 (2006.01); C08K 3/36 (2006.01); C08K 5/5419 (2006.01); C08K 5/544 (2006.01); C08K 9/06 (2006.01); C08L 33/08 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 73/12 (2013.01); B32B 5/26 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/38 (2013.01); C08G 59/56 (2013.01); C08G 59/686 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/36 (2013.01); C08K 5/5419 (2013.01); C08K 9/06 (2013.01); C08L 33/08 (2013.01); C08L 63/00 (2013.01); C08L 79/08 (2013.01); H01L 23/145 (2013.01); H01L 23/562 (2013.01); H05K 1/0271 (2013.01); H05K 1/0373 (2013.01); B32B 2250/40 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/734 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); C08J 2363/00 (2013.01); C08J 2433/08 (2013.01); C08J 2479/08 (2013.01); C08K 2201/003 (2013.01); C08K 2201/014 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); H05K 2201/068 (2013.01);
Abstract
The present disclosure relates to a thermosetting resin composite having a specific thermal stress factor, and capable of implementing a low glass transition temperature, low modulus, and a low coefficient of thermal expansion, and minimizing warpage, and having excellent flowability in a prepreg or semi-cured state, and a metal clad laminate using the same.