The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Mar. 25, 2021
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Yuichiro Goto, Shizuoka, JP;
Akihiro Hakamata, Shizuoka, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 61/04 (2006.01); C08F 222/10 (2006.01); C08K 3/08 (2006.01); G03F 7/00 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
C08G 61/04 (2013.01); C08F 222/1025 (2020.02); C08K 3/08 (2013.01); G03F 7/0002 (2013.01); H01L 21/0271 (2013.01); C08K 2201/003 (2013.01); C08K 2201/011 (2013.01);
Abstract
Provided are a composition for forming an underlayer film for imprinting, including a curable component, and a particulate metal which has a particle diameter of 10 nm or larger, as measured by a single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 50 ppt by mass to 10 ppb by mass with respect to the composition; a method for producing a composition for forming an underlayer film for imprinting; a pattern producing method; a method for manufacturing a semiconductor element; a cured product; and a kit.