The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Jun. 17, 2019
Toray Industries, Inc., Tokyo, JP;
Kazunori Hondo, Nagoya, JP;
Nobuyuki Tomioka, Nagoya, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
The present invention provides: an epoxy resin composition which has satisfactory handleability during refrigerated transport, is stable and inhibited from increasing in viscosity for a long period even when held at ordinary temperature, well infiltrates into reinforcing fibers, can be sufficiently rapidly cured at a temperature as high as 180° C., and gives molded objects that can be smoothly demolded in a demolding step after the molding since the resin has sufficiently cured and has high heat resistance imparted thereto; and a fiber-reinforced composite material obtained using the epoxy resin composition. The epoxy resin composition for use in producing fiber-reinforced composite materials comprises an epoxy resin and a hardener, and includes tetraglycidyldiaminodiphenylmethane [A], 4,4'-methylenebis(2-isopropyl-6-methylaniline) [B], and a bisphenol F type epoxy resin [C] in a specific proportion, and satisfies 200≤η30/η80≤500 and 50≤η80≤180, where the viscosities of the resin at 30° C. and 80° C. are expressed by η30 and η80 respectively (unit, mPa·s).