The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Nov. 05, 2019
Robert Bosch Gmbh, Stuttgart, DE;
Ken Chang, Taipei, TW;
Wallace Chuang, Taipei, TW;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
The present utility model discloses a package assembly of a sensor, comprising: a redistribution layer having a first face and a second face that are opposite to each other, and a first via that penetrates the first face and the second face; a first die electrically connected to the first face of the redistribution layer; a sensing element electrically connected to the first face of the redistribution layer; a cover body located between the redistribution layer and the sensing element, wherein the cover body has a second via that penetrates the cover body, and the second via communicates with the first via; and a moulding compound comprising a third face and a fourth face that are opposite to each other, wherein the moulding compound encapsulates the first die and the sensing element on the side of the first face of the redistribution layer, and the third face of the moulding compound is combined with the first face of the redistribution layer. The package assembly of the sensor allows more components to be packaged together, provides a better structural support and heat distribution, and reduces the volume and costs of the package assembly.