The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jun. 17, 2016
Applicant:

United States Gypsum Company, Chicago, IL (US);

Inventors:

Alfred C. Li, Naperville, IL (US);

Weixin D. Song, Vernon Hills, IL (US);

Yijun Sang, Oak Park, IL (US);

Gregg G. Diefenbacher, Mars, PA (US);

Annamaria Vilinska, Chicago, IL (US);

Brian J. Christ, Burlington, IA (US);

Fredrick T. Jones, Grayslake, IL (US);

Bradley W. Todd, Hainesville, IL (US);

Assignee:

UNITED STATES GYPSUM COMPANY, Chicago, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2019.01); B32B 13/02 (2006.01); B32B 13/04 (2006.01); B32B 13/08 (2006.01); B32B 13/14 (2006.01); B32B 37/14 (2006.01); C04B 11/00 (2006.01); C04B 22/16 (2006.01); C04B 24/38 (2006.01); C04B 28/14 (2006.01); E04C 2/04 (2006.01); B32B 37/15 (2006.01); C04B 111/00 (2006.01); C04B 111/30 (2006.01);
U.S. Cl.
CPC ...
B32B 7/02 (2013.01); B32B 13/02 (2013.01); B32B 13/04 (2013.01); B32B 13/08 (2013.01); B32B 13/14 (2013.01); B32B 37/144 (2013.01); C04B 11/00 (2013.01); C04B 11/002 (2013.01); C04B 22/16 (2013.01); C04B 24/383 (2013.01); C04B 28/14 (2013.01); E04C 2/043 (2013.01); B32B 37/15 (2013.01); B32B 2250/04 (2013.01); B32B 2250/40 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/02 (2013.01); B32B 2264/0228 (2013.01); B32B 2264/06 (2013.01); B32B 2264/062 (2013.01); B32B 2307/50 (2013.01); B32B 2307/51 (2013.01); B32B 2307/536 (2013.01); B32B 2307/54 (2013.01); B32B 2307/718 (2013.01); B32B 2307/72 (2013.01); B32B 2419/00 (2013.01); B32B 2419/04 (2013.01); B32B 2419/06 (2013.01); B32B 2607/00 (2013.01); C04B 2111/00413 (2013.01); C04B 2111/0062 (2013.01); C04B 2111/30 (2013.01); C04B 2201/20 (2013.01);
Abstract

Disclosed is a composite gypsum board comprising a board core and a concentrated layer of substantial thickness (e.g., at least about 0.02 inches). The concentrated layer includes a higher weight percentage of an enhancing additive than the hoard core. The board core has a thickness greater than the thickness of the concentrated layer and forms the bulk of the board volume. The concentrated layer has a higher density (e.g., at least about 1.1 times greater) than the density of the board core. Also disclosed is a method of preparing a composite gypsum board.


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