The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Nov. 18, 2020
Applicant:
Toyo Seikan Co., Ltd., Tokyo, JP;
Inventors:
Toshiki Yamada, Yokohama, JP;
Yuji Ueda, Yokohama, JP;
Takahiro Yasuumi, Yokohama, JP;
Koichi Ishizaka, Yokohama, JP;
Assignee:
TOYO SEIKAN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 7/027 (2019.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 27/32 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2272/00 (2013.01); B32B 2307/31 (2013.01); B32B 2307/51 (2013.01); B32B 2307/5825 (2013.01); B32B 2307/732 (2013.01); B32B 2439/00 (2013.01); B32B 2553/00 (2013.01);
Abstract
Provided is a laminate that is excellent in heat sealing properties and is suitable for reuse. The laminate includes: a first layer having a melting point of Tmand containing a first polyethylene alone as a resin; and a second layer having a melting point of Tmand containing a second polyethylene alone as a resin, where: the first layer and the second layer are disposed respectively as outermost surfaces of the laminate; and Tm−Tm≥24.0° C. is satisfied.