The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jul. 07, 2020
Applicant:

University of Rochester, Rochester, NY (US);

Inventors:

Kenneth L. Marshall, Rochester, NY (US);

Stavros G. Demos, Rochester, NY (US);

Tanya Kosc, Rochester, NY (US);

Assignee:

University of Rochester, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/282 (2017.01); B22F 10/00 (2021.01); B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 10/362 (2021.01); B22F 10/364 (2021.01); B22F 10/38 (2021.01); B22F 10/50 (2021.01); B22F 12/13 (2021.01); B22F 12/41 (2021.01); B22F 12/43 (2021.01); B22F 12/44 (2021.01); B22F 12/45 (2021.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/064 (2014.01); B23K 26/342 (2014.01); B29C 64/00 (2017.01); B29C 64/10 (2017.01); B29C 64/153 (2017.01); B29C 64/20 (2017.01); B29C 64/268 (2017.01); B33Y 30/00 (2015.01); B22F 10/368 (2021.01);
U.S. Cl.
CPC ...
B29C 64/282 (2017.08); B22F 10/00 (2021.01); B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 10/362 (2021.01); B22F 10/364 (2021.01); B22F 10/38 (2021.01); B22F 10/50 (2021.01); B22F 12/13 (2021.01); B22F 12/41 (2021.01); B22F 12/43 (2021.01); B22F 12/44 (2021.01); B22F 12/45 (2021.01); B23K 26/0624 (2015.10); B23K 26/064 (2015.10); B23K 26/342 (2015.10); B29C 64/00 (2017.08); B29C 64/10 (2017.08); B29C 64/153 (2017.08); B29C 64/20 (2017.08); B29C 64/268 (2017.08); B22F 10/368 (2021.01); B33Y 30/00 (2014.12);
Abstract

Additive manufacturing systems and methods utilizing an optical light valve configured to spatially modulate the intensity of a laser beam, in conjunction with a writing and erasing sub-system configured to repeatedly write and erase patterns in the optical light valve to repeatedly vary the spatial modulation of the laser beam. In some implementations, the systems and methods may also employ additional laser beams or other energy sources that are not spatially modulated by the optical light valve. In some implementations, the systems and methods may employ additional laser beams or other energy sources configured to reduce surface roughness of the powder or other material being used for additive manufacturing.


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