The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Oct. 10, 2022
Applicant:

Foundation for Research and Business, Seoul National University of Science and Technology, Seoul, KR;

Inventors:

Keun Park, Seoul, KR;

Junwon Lee, Seoul, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/73 (2006.01); B29C 45/40 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 45/73 (2013.01); B29C 45/401 (2013.01); B33Y 80/00 (2014.12);
Abstract

Provided is a cooling module to which a microporous cooling structure is applied, and a method of locally and conformally cooling a mold using the same. The cooling module to which a microporous cooling structure is applied which is installed at each high temperature region inside a mold core and allows supplied cooling fluid to flow thereinto to perform local and conformal cooling on a mold may include a body part inserted into the mold core, a microporous cooling structure which is inserted into an upper portion of the body part and in which micro unit cells are periodically and repeatedly formed to form a plurality of connected hollow portions, and a cooling channel including a conduit configured to pass the cooling fluid through the microporous cooling structure.


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