The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Apr. 17, 2020
Applicant:

Shoei Chemical Inc., Tokyo, JP;

Inventors:

Ruiqing Ma, Morristown, NJ (US);

Jason Hartlove, Los Altos, CA (US);

Charles Hotz, San Rafael, CA (US);

Assignee:

SHOEI CHEMICAL INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/858 (2023.01); H10K 50/115 (2023.01); H10K 50/844 (2023.01); H10K 50/87 (2023.01); H10K 71/00 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/858 (2023.02); H10K 50/115 (2023.02); H10K 71/00 (2023.02); H10K 50/844 (2023.02); H10K 50/87 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

Embodiments of a flexible electroluminescent (FEE) device are described. An FEE device includes a device stack with a quantum dot (QD) film configured to generate a first light having a first peak wavelength and a flexible substrate configured to support the device stack and emit a first portion of the first light. The FEE device further includes an encapsulation layer disposed on the device stack and an outcoupling layer disposed on the flexible substrate. The encapsulation layer can be configured to provide mechanical and environmental protection to the FEE device from moisture or oxygen. The outcoupling layer can be configured to prevent total internal reflection of a second portion of the first light within the flexible substrate and extract the second portion from the flexible substrate. The outcoupling layer can be further configured to eliminate air gaps at an interface between the outcoupling layer and a surface to be illuminated by the extracted second portion in response to the FEE device being substantially conformally placed on the surface.


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