The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jun. 22, 2023
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Masayoshi Tagami, Kuwana, JP;

Jun Iijima, Yokkaichi, JP;

Ryota Katsumata, Yokkaichi, JP;

Kazuyuki Higashi, Yokohama, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01); G11C 5/02 (2006.01); G11C 16/04 (2006.01); G11C 16/26 (2006.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H01L 23/5226 (2013.01); H01L 24/04 (2013.01); H01L 25/0657 (2013.01); H10B 43/10 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02); G11C 5/02 (2013.01); G11C 16/0483 (2013.01); G11C 16/26 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/05095 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80895 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1434 (2013.01);
Abstract

According to one embodiment, a semiconductor memory device includes a first memory chip, a circuit chip, and an external connection electrode on a surface of the first memory chip. The first memory chip comprises first conductors stacked via an insulator, and a first pillar passing the first conductors. The circuit chip comprises a substrate, a control circuit, and a second conductor connected to the control circuit, the circuit chip being attached to the first memory chip. The external connection electrode comprises a portion extending from a side of the surface of the first memory chip through the first memory chip and connected to the second conductor. Part of the first conductors is between the external connection electrode and the substrate.


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