The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jan. 26, 2022
Applicant:

Aio Core Co., Ltd., Tokyo, JP;

Inventors:

Shigeru Kobayashi, Tokyo, JP;

Kazuhiro Shiba, Tokyo, JP;

Mitsuru Kurihara, Tokyo, JP;

Kazuhiko Kurata, Tokyo, JP;

Assignee:

AIO CORE CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G02F 1/01 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); G02F 1/011 (2013.01);
Abstract

To provide an opto-electric module that can be cooled efficiently. An opto-electric module comprises: an opto-electric hybrid device provided with an electronic circuit and an optical circuit driven by the electronic circuit, the opto-electric hybrid device having a first surface and a second surface on an opposite side from the first surface, such that an electrical input and output unit with respect to the electronic circuit and an optical input and output unit with respect to the optical circuit are disposed on the first surface; an interface substrate which is disposed near the first surface of the opto-electric hybrid device and which is provided with an electrical interconnect coupled to the electrical input and output unit, an optical interconnect coupled to the optical input and output unit, an electrical interface which is connected to the electrical interconnect and also connectible to an external electrical interconnect, and an optical interface which is connected to the optical interconnect and also connectible to an external optical interconnect; and a heat-dissipating member disposed in contact with the second surface of the opto-electric hybrid device.


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