The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Oct. 03, 2022
Applicant:

Te Connectivity Solutions Gmbh, Schaffhausen, CH;

Inventors:

Christopher William Blackburn, Bothell, WA (US);

Jeffery Walter Mason, North Attleboro, MA (US);

Nathan Lincoln Tracy, Harrisburg, PA (US);

Clarence Leon Yu, Sacramento, CA (US);

Michael David Herring, Apex, NC (US);

Assignee:

TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H05K 7/1084 (2013.01); H01R 12/7076 (2013.01); H01R 12/714 (2013.01); H05K 7/1069 (2013.01); H05K 7/1092 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2018 (2013.01);
Abstract

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.


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