The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Sep. 23, 2020
Applicant:
Canatu Oy, Vantaa, FI;
Inventor:
Ilkka Varjos, Espoo, FI;
Assignee:
CANATU OY, Vantaa, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01); G06F 3/041 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/20 (2006.01); H05K 3/22 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/22 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 37/1018 (2013.01); B32B 38/0004 (2013.01); B32B 38/145 (2013.01); G06F 3/041 (2013.01); H05K 1/0298 (2013.01); H05K 1/0313 (2013.01); H05K 3/20 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 2250/24 (2013.01); B32B 2250/40 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2270/00 (2013.01); B32B 2307/412 (2013.01); B32B 2309/02 (2013.01); B32B 2323/04 (2013.01); B32B 2323/10 (2013.01); B32B 2327/06 (2013.01); B32B 2333/12 (2013.01); B32B 2367/00 (2013.01); B32B 2369/00 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01); G06F 2203/04103 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1121 (2013.01);
Abstract
A layered device having two base films, a conductive pattern attached to the first base film facing the second base film and a bonding layer binding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern having an exposed portion aligned with the opening in the bonding layer. Further disclosed is a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer. Also disclosed is a method of producing a layered device.