The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Sep. 01, 2022
Applicant:

Reophotonics, Ltd., Modiin, IL;

Inventors:

Michael Zenou, Hashmonaim, IL;

Stéphane Etienne, Bouaye, FR;

Assignee:

REOPHOTONICS, LTD., Modiin, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); B41M 5/00 (2006.01); C23C 14/28 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1291 (2013.01); B41M 5/0041 (2013.01); C23C 14/28 (2013.01); C23C 14/5806 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1105 (2013.01);
Abstract

Methods for creating a conductive pillar on a receiver substrate may include forming a dried metal paste pillar by printing metal paste over an area of a receiver substrate, drying the metal paste, and repeating the printing and drying steps. The dried metal paste pillar may be inspected so as to determine a height of the dried metal paste pillar. If the height of the dried metal paste pillar is less than a desired height, additional metal paste may be printed onto to the dried metal paste pillar and dried. If the height of the dried metal paste pillar exceeds the desired height, a portion of the dried metal paste pillar may be ablated. The dried metal paste pillar may be sintered so as to form the conductive pillar. Conductive pillars that are produced according to the methods may be used as part of the formation of a flip-chip assembly.


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