The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Nov. 20, 2019
Applicant:

Sentec Ltd, Cambridge, GB;

Inventors:

Andrew Nicholas Dames, Cambridge, GB;

Dawei Zhi, Cambridge, GB;

Joseph Adam, Impington, GB;

Assignee:

SENTEC LTD, Cambridge, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); G01R 15/18 (2006.01); G01R 21/06 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); G01R 15/185 (2013.01); G01R 21/06 (2013.01); H05K 1/0259 (2013.01); H05K 1/115 (2013.01);
Abstract

An electricity meter () is described which includes a conductor () for transferring energy from a supply () to a load (). The electricity meter () also includes a multi-layer printed circuit board () mechanically attached to the conductor (). The multi-layer printed circuit board () includes two or more insulating layers (). The two or more insulating layers () include a first insulating layer () having an attachment surface () facing the conductor (). The multi-layer printed circuit board () also includes a first conductive layer () including a first planar sensor coil (). The first insulating layer () is between the first conductive layer () and the conductor (). The multi-layer printed circuit board () also includes a second conductive layer () including a second planar sensor coil (). The multi-layer printed circuit board () also includes a second insulating layer () between the first () and second () conductive layers. The first planar sensor coil () and the second planar sensor coil () are electrically connected to one another by a buried via (), or the first planar sensor coil () and the second planar sensor coil () are electrically connected to one another by a blind via () extending inwards from a back surface () of the multi-layer printed circuit board (), the back surface () being opposed to the attachment surface ().


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