The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jun. 28, 2019
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Zhewen Mei, Zhejiang, CN;

Qimin Mei, Zhejiang, CN;

Bojie Zhao, Zhejiang, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 23/55 (2023.01); G02B 7/02 (2021.01); H04N 23/54 (2023.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H04N 23/55 (2023.01); G02B 7/022 (2013.01); H04N 23/54 (2023.01); H05K 5/0034 (2013.01); G03B 2205/0053 (2013.01);
Abstract

A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.


Find Patent Forward Citations

Mei, Zhewen. (2024). Molding assembly, camera module, molding assembly jointed board and manufacturing method (U.S. Patent No. 12088898). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12088898

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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