The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Mar. 09, 2023
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Koichi Mizugaki, Suwa, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01); H03B 1/02 (2006.01); H03B 5/04 (2006.01); H03L 1/02 (2006.01); H03L 1/04 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H10N 30/88 (2023.01);
U.S. Cl.
CPC ...
H03B 5/32 (2013.01); H03B 1/02 (2013.01); H03B 5/04 (2013.01); H03L 1/028 (2013.01); H03L 1/04 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H10N 30/88 (2023.02); H05K 2201/10083 (2013.01);
Abstract
A circuit board includes: a semiconductor substrate including a first surface and a second surface located at an opposite side from the first surface; a circuit provided at a first surface side; a first external electrode provided at a second surface side; a heater provided at the second surface side; and a plurality of through electrodes penetrating the first surface and the second surface and electrically coupling the circuit and the first external electrode or the heater. The heater and the first external electrode do not overlap each other in a plan view.