The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jul. 21, 2021
Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Tomohiro Ikeda, Osaka, JP;

Hiroyuki Yoshimoto, Osaka, JP;

Taku Yamanaka, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/16 (2006.01); C08J 7/04 (2020.01); H01P 3/00 (2006.01); H01P 3/10 (2006.01);
U.S. Cl.
CPC ...
H01P 3/16 (2013.01); C08J 7/0427 (2020.01); H01P 3/00 (2013.01); H01P 3/10 (2013.01); C08J 2327/18 (2013.01); C08J 2427/18 (2013.01);
Abstract

A wiring board including a dielectric line containing a resin (A), and a dielectric exterior covering the dielectric line and containing a resin (B). The dielectric exterior has a relative permittivity lower than a relative permittivity of the dielectric line at 6 GHz and 25° C.


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