The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Dec. 30, 2022
Applicant:
Nuvoton Technology Corporation Japan, Kyoto, JP;
Inventors:
Mitsuaki Oya, Tokyo, JP;
Masanori Hiroki, Shiga, JP;
Keimei Masamoto, Niigata, JP;
Shigeo Hayashi, Kyoto, JP;
Assignee:
NUVOTON TECHNOLOGY CORPORATION JAPAN, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); F21S 41/141 (2018.01); F21S 43/14 (2018.01); F21W 103/55 (2018.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21S 41/141 (2018.01); F21S 43/14 (2018.01); F21W 2103/55 (2018.01); H01L 2933/0066 (2013.01);
Abstract
A semiconductor device includes: a first electrode provided on a semiconductor multilayer structure: a second electrode provided on a substrate; and a bonding metal layer which bonds the first electrode and the second electrode together. The bonding metal layer includes a gap inside.