The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Oct. 31, 2019
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhiwei Liang, Beijing, CN;

Wenqian Luo, Beijing, CN;

Zhijun Lv, Beijing, CN;

Yingwei Liu, Beijing, CN;

Ke Wang, Beijing, CN;

Zhanfeng Cao, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/1607 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81345 (2013.01); H01L 2224/81898 (2013.01);
Abstract

The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.


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