The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Jul. 30, 2020
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Andreas Dobner, Wenzenbach, DE;
Hubert Halbritter, Dietfurt, DE;
Assignee:
OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60Q 3/208 (2017.01); B32B 17/10 (2006.01); B60J 1/00 (2006.01); B60Q 1/24 (2006.01); B60Q 1/50 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); B32B 17/10036 (2013.01); B32B 17/10477 (2013.01); B32B 17/10504 (2013.01); B32B 17/10513 (2013.01); B60J 1/001 (2013.01); B60Q 1/247 (2022.05); B60Q 1/50 (2013.01); B60Q 1/5035 (2022.05); B60Q 1/507 (2022.05); B60Q 1/543 (2022.05); B60Q 3/208 (2017.02); H01L 25/167 (2013.01); B32B 2307/412 (2013.01); B32B 2605/006 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 33/62 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2924/0549 (2013.01); H01L 2924/12041 (2013.01);
Abstract
A light-emitting window element includes a transparent first carrier layer, a transparent second carrier layer, a substrate with a plurality of light-emitting semiconductor chips arranged thereon, and an optical layer having an adjustable transparency. The substrate with the plurality of light-emitting semiconductor chips and the optical layer are arranged between the first and second carrier layers, and the first and second carrier layers, the substrate with the plurality of light-emitting semiconductor chips and the optical layer form a laminate composite.