The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Oct. 21, 2021
Applicant:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Inventors:

Sebastien Petitdidier, La Terrasse, FR;

Nicolas Hotellier, Jarrie, FR;

Raul Andres Bianchi, Myans, FR;

Alexis Farcy, La Ravoire, FR;

Benoit Froment, Grenoble, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/58 (2006.01); H01L 23/64 (2006.01); H03K 3/3565 (2006.01);
U.S. Cl.
CPC ...
H01L 23/576 (2013.01); H01L 21/31111 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 23/481 (2013.01); H01L 23/49855 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 23/57 (2013.01); H01L 23/573 (2013.01); H01L 23/585 (2013.01); H01L 23/642 (2013.01); H03K 3/3565 (2013.01); H01L 23/293 (2013.01);
Abstract

A method for fabricating a semiconductor chip includes forming a plurality of conducting pads at a front face of a substrate, thinning a rear face of the substrate, etching openings under each conducting pad from the rear face, depositing a layer of a dielectric on walls and a bottom of the openings, forming a conducting material in the openings, and forming a conducting strip on the rear face. The conducting strip is electrically connected to the conducting material of each of the openings. The etching is stopped when the respective conducting pad is reached.


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