The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Nov. 19, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 29/16 (2006.01); H01L 29/40 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/3178 (2013.01); H01L 29/1608 (2013.01); H01L 29/404 (2013.01); H01L 29/0619 (2013.01);
Abstract
An oxide film () is provided on an upper surface of the semiconductor substrate (). A guard ring () is provided on the upper surface of the semiconductor substrate (). An organic insulating film () directly contacts the oxide film () in a termination region () between the guard ring () and an outer edge portion of the semiconductor substrate (). A groove () is provided on the upper surface of the semiconductor substrate () in the termination region (). The groove () is embedded with the organic insulating film ().