The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Dec. 09, 2021
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Thomas Sprafke, Huntsville, UT (US);

Stephen Marinsek, Albuquerque, NM (US);

Christopher Cobb, Goleta, CA (US);

Assignee:

Raytheon Company, Tewksbury, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G01J 3/02 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); G01J 3/0202 (2013.01); H01L 23/40 (2013.01);
Abstract

A composite structure includes a first surface and a second surface sandwiched together with a field array of individual and discrete pillars extending therebetween. The plurality of discrete pillars each have a tailored coefficient of thermal expansion and are designed to expand and contract over varying temperatures. The discrete pillars are specifically arranged within the composite structure to compensate for the shrinkage and expansion of different components of a microelectronic hybrid device, to reduce thermal expansion induced deformations imparted on facets of the microelectronic hybrid device under varying temperatures.


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