The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Jan. 28, 2021
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Chunjian Liu, Beijing, CN;
Zouming Xu, Beijing, CN;
Feifei Wang, Beijing, CN;
Qin Zeng, Beijing, CN;
Xintao Wu, Beijing, CN;
Jian Tian, Beijing, CN;
Jie Lei, Beijing, CN;
Jie Wang, Beijing, CN;
Yufei Zhan, Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.