The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Dec. 30, 2021
Applicant:
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
François Tailliet, Fuveau, FR;
Guilhem Bouton, Peynier, FR;
Assignee:
STMICROELECTRONICS (ROUSSET) SAS, Rousset, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/02 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/76895 (2013.01); H01L 22/20 (2013.01); H01L 22/22 (2013.01); H01L 22/32 (2013.01); H01L 23/528 (2013.01); H01L 27/0207 (2013.01); H01L 28/60 (2013.01); H01L 22/14 (2013.01);
Abstract
A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.