The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Mar. 18, 2020
Applicant:

Ampleon Netherlands B.v., Nijmegen, NL;

Inventors:

Frans Meeuwsen, Nijmegen, NL;

Jurgen Raben, Nijmegen, NL;

Assignee:

Ampleon Netherlands B.V., Nijmegen, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/053 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/48151 (2013.01);
Abstract

Example embodiments relate to an electronic package, to an electronic device comprising such a package, and to a lead frame for manufacturing the electronic package. Some examples may particularly relate to electronic packages in which radiofrequency (RF) circuitry is arranged. According to the example embodiments, a width of the clamping portion is substantially larger than the width of the lead end portion, the width of the clamping portion being chosen such that bending of the inner part and/or body part relative to the outer part during the application of the molding compound was substantially prevented thereby having avoided flash and/or bleed of molding compound onto the inner part.


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