The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jul. 09, 2020
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Gerald Joseph Brady, Glen Ellyn, IL (US);

Kevin M. McLaughlin, Sherwood, OR (US);

Pratik Sankhe, Wilsonville, OR (US);

Bart J. van Schravendijk, Palo Alto, CA (US);

Shriram Vasant Bapat, Beaverton, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01); H10N 50/01 (2023.01);
U.S. Cl.
CPC ...
H01L 21/02244 (2013.01); C23C 16/4408 (2013.01); C23C 16/45502 (2013.01); C23C 16/45527 (2013.01); C23C 16/45565 (2013.01); C23C 16/4583 (2013.01); C23C 16/52 (2013.01); H10N 50/01 (2023.02);
Abstract

Methods and apparatuses are provided herein for oxidizing an annular edge region of a substrate. A method may include providing the substrate to a substrate holder in a semiconductor processing chamber, the semiconductor processing chamber having a showerbead positioned above the substrate holder, and simultaneously flowing, while the substrate is supported by the substrate holder, (a) an oxidizing gas around a periphery of the substrate and (b) an inert gas that does not include oxygen through the showerhead and onto the substrate, thereby creating an annular gas region over an annular edge region of the substrate and an interior gas region over on an interior region of the substrate; the simultaneous flowing is not during a deposition of a material onto the substrate, and the annular gas region has an oxidization rate higher than the interior gas region.


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