The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Mar. 06, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seora Park, Suwon-si, KR;
Jungsik Choi, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a semiconductor fabrication system may include preparing a first vacuum pipe, preparing a second vacuum pipe, connecting a first process chamber to a first pump through the first vacuum pipe, and connecting a second process chamber, which is spaced apart from the first process chamber, to a second pump through the second vacuum pipe. The preparing of the first vacuum pipe may include connecting a plurality of first unit pipes to form the first vacuum pipe and calculating a first conductance, which is a total conductance of the first vacuum pipe. The preparing of the second vacuum pipe may include forming the second vacuum pipe by connecting a plurality of second unit pipes such that the second conductance, which is a total conductance of the second vacuum pipe, is equal to the first conductance.