The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
May. 24, 2021
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Wenjie Xu, Beijing, CN;
Feifei Yu, Beijing, CN;
Xiaodong Xie, Beijing, CN;
Jing Wang, Beijing, CN;
Tengfei Zhong, Beijing, CN;
Huayu Sang, Beijing, CN;
Xue Zhao, Beijing, CN;
Bin Pang, Beijing, CN;
Xinxiu Zhang, Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Hefei, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
The present disclosure provides a thin film sensor and a method for preparing a thin film sensor. The thin film sensor includes: a base substrate; a first conductive mesh on the base substrate; where the first conductive mesh includes first metal wires arranged side by side along a first direction and each extending in a second direction, and second metal wires each extending in a third direction; and the first metal wires intersect with the second metal wires; and a second conductive mesh on a side of the first conductive mesh away from the base substrate; where the second conductive mesh includes first transparent conductive wires arranged side by side along the first direction and each extending in the second direction, and second transparent conductive wires each extending in the third direction; and the first transparent conductive wires intersect with the second transparent conductive wires.