The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Aug. 10, 2021
Applicant:
Heraeus Materials Singapore Pte. Ltd., Singapore, SG;
Inventors:
Miew Wan Lo, Singapore, SG;
Murali Sarangapani, Singapore, SG;
Assignee:
HERAEUS MATERIALS SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/06 (2006.01); C22C 1/02 (2006.01); C22C 5/02 (2006.01); C22C 5/06 (2006.01); C22F 1/14 (2006.01); C25D 3/12 (2006.01); C25D 3/48 (2006.01); C25D 3/50 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); C25D 5/34 (2006.01); C25D 5/50 (2006.01); H01B 5/02 (2006.01); H01B 13/00 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C25D 7/0607 (2013.01); C22C 1/02 (2013.01); C22C 5/02 (2013.01); C22C 5/06 (2013.01); C22F 1/14 (2013.01); C25D 3/12 (2013.01); C25D 3/48 (2013.01); C25D 3/50 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/34 (2013.01); C25D 5/50 (2013.01); H01B 5/02 (2013.01); H01B 13/0016 (2013.01); H01B 1/02 (2013.01); Y10T 428/12875 (2015.01);
Abstract
A wire comprising a silver-based wire core having a double-layer coating comprised of an inner layer of palladium or nickel and an adjacent outer layer of gold, wherein the wire exhibits at least one of the intrinsic properties A1) to A3):