The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Nov. 26, 2019
Applicant:
Teijin Limited, Osaka, JP;
Inventors:
Assignee:
TEIJIN LIMITED, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/12 (2006.01); C08J 5/24 (2006.01); C08L 79/08 (2006.01); C09J 7/10 (2018.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
C08G 73/128 (2013.01); C08J 5/243 (2021.05); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08L 79/085 (2013.01); C09J 7/10 (2018.01); C09J 7/38 (2018.01); C08J 2379/08 (2013.01); C09J 2400/12 (2013.01); C09J 2479/08 (2013.01);
Abstract
The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.
Horikawa, Miki. (2024). Thermosetting resin composition, film adhesive, prepreg, and production method thereof (U.S. Patent No. 12084546). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12084546
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile