The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

May. 02, 2023
Applicant:

Chewie Labs Llc, San Bruno, CA (US);

Inventors:

Matthew Lee Rogers, San Francisco, CA (US);

Harry E. Tannenbaum, San Francisco, CA (US);

Adam Mittleman, Redwood City, CA (US);

Kelly Joan Veit, San Francisco, CA (US);

Kristen Rose Virdone, San Francisco, CA (US);

Alyssa Noelle Pollack, Lone Tree, CO (US);

Azita Sayadi, San Francisco, CA (US);

Shayan Sayadi, Mill Valley, CA (US);

Geoffrey Becker Hill, Seattle, WA (US);

Jaideep Singh Chavan, Mountain View, CA (US);

William Bryson Gardner, Louisville, CO (US);

Emma Elizabeth Feshbach Bright, Palo Alto, CA (US);

Pinida Jan Moolsintong, San Francisco, CA (US);

Taylor A. Nam, San Francisco, CA (US);

Rochus Emanuel Jacob, San Francisco, CA (US);

Saket Vora, Santa Cruz, CA (US);

Assignee:

Chewie Labs LLC, San Bruno, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C05F 17/907 (2020.01); B02C 18/00 (2006.01); B02C 23/24 (2006.01); B09B 3/35 (2022.01); B09B 3/40 (2022.01); C05F 9/02 (2006.01); C05F 9/04 (2006.01); C05F 17/60 (2020.01); C05F 17/964 (2020.01); B02C 18/06 (2006.01); B02C 18/16 (2006.01); B09B 101/70 (2022.01);
U.S. Cl.
CPC ...
C05F 17/907 (2020.01); B02C 18/0092 (2013.01); B02C 23/24 (2013.01); B09B 3/35 (2022.01); B09B 3/40 (2022.01); C05F 9/02 (2013.01); C05F 9/04 (2013.01); C05F 17/60 (2020.01); C05F 17/964 (2020.01); B02C 18/067 (2013.01); B02C 2018/162 (2013.01); B09B 2101/70 (2022.01);
Abstract

Embodiments disclosed herein provide an organic matter processing apparatus and method for the use thereof to convert organic matter into a ground and desiccated product. This can be accomplished using a bucket assembly that can grind, paddle, and heat organic matter contained therein. An air treatment system is provided to treat the air interacting with the organic matter.


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