The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Apr. 24, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Koji Kawamura, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65H 37/04 (2006.01); B42C 1/12 (2006.01); B65H 9/04 (2006.01); B65H 29/60 (2006.01); B65H 37/02 (2006.01);
U.S. Cl.
CPC ...
B65H 37/04 (2013.01); B42C 1/12 (2013.01); B65H 9/04 (2013.01); B65H 29/60 (2013.01); B65H 37/02 (2013.01); B65H 2301/1511 (2013.01); B65H 2301/163 (2013.01); B65H 2301/43822 (2013.01); B65H 2404/14 (2013.01); B65H 2513/42 (2013.01); B65H 2801/27 (2013.01);
Abstract

A sheet processing apparatus includes a stacking unit configured to stack a plurality of sheets, an alignment unit including a supporting portion on which the sheets are loaded, the alignment unit being configured to align positions of the sheets loaded on the supporting portion, and a bonding unit configured to bond the sheets loaded on the supporting portion to each other. The alignment unit is configured to align a position of the second sheet stack with the first sheet stack. The bonding unit is configured to heat and pressurize the second sheet stack aligned by the alignment unit such that sheets of the second sheet stack are bonded to each other with the adhesive and the first sheet stack and the second sheet stack are bonded to each other with the adhesive.


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