The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jul. 29, 2020
Applicant:

Siempelkamp Maschinen- Und Anlagenbau Gmbh, Krefeld, DE;

Inventors:

Fabian Köffers, Krefeld, DE;

Michael Schöler, Rheurdt, DE;

Klaus Schürmann, Jüchen, DE;

Lothar Sebastian, Duisburg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B29C 70/34 (2006.01); B29C 70/54 (2006.01);
U.S. Cl.
CPC ...
B29C 70/342 (2013.01); B29C 70/54 (2013.01); B29K 2995/0097 (2013.01);
Abstract

A method and a device for producing a component from a fiber composite material. The method includes introducing multiple layers of fibers impregnated with a matrix onto an inner mold, placing a membrane sealed against an outer mold onto the fibers impregnated with the matrix, such that a cavity extending along the shell surface of the outer mold forms between the outer mold and the membrane, and applying a temperature-controllable pressure fluid to the cavity at a temperature greater than the melting point of the matrix and at a pressure greater than the ambient pressure. To produce a component having at least one reinforcing layer, at least one reinforcing layer having fibers oriented in a predominantly parallel manner is placed locally onto a portion of a side of a the base layer facing the outer mold with the aid of an insertion device and a membrane with an average surface roughness of below 1.0 μm, preferably below 0.1 μm, subsequently exerts a set pressure in the cavity on the component.


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