The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Dec. 20, 2018
Applicant:
Powerphotonic Ltd., Dalgety Bay, GB;
Inventors:
Paul Blair, Dalgety Bay, GB;
Chris Courtney, Dalgety Bay, GB;
Tina Parsonage, Dalgety Bay, GB;
Amiel Lopes, Edinburgh, GB;
Krystian L. Wlodarczyk, Edinburgh, GB;
Duncan P. Hand, Edinburgh, GB;
Assignee:
POWER PHOTONIC LTD., , GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/0622 (2014.01); B23K 26/00 (2014.01); B23K 26/08 (2014.01); B23K 26/082 (2014.01); B23K 26/352 (2014.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01); B23K 103/00 (2006.01); B29D 11/00 (2006.01); C03C 23/00 (2006.01); G02B 27/09 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0624 (2015.10); B23K 26/0006 (2013.01); B23K 26/082 (2015.10); B23K 26/0853 (2013.01); B23K 26/352 (2015.10); B23K 26/355 (2018.08); B23K 26/3576 (2018.08); B23K 26/36 (2013.01); B23K 26/40 (2013.01); B29D 11/00 (2013.01); B29D 11/00298 (2013.01); C03C 23/0025 (2013.01); G02B 27/0961 (2013.01); H01S 5/4043 (2013.01); B23K 2103/54 (2018.08); B29D 11/00932 (2013.01);
Abstract
A direct write laser based machining process wherein a laser beam is controlled to machine a glass material in an interlaced raster scan pattern. An embodiment of machining a glass substrate to form an optical element is described. An ultrashort pulsed laser is used for machining and smoothing fused silica, followed by COlaser polishing. High speed and high quality machining is possible using this approach, which allows efficient use of high laser repetition rates.