The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Dec. 19, 2019
Applicant:

Jabil Inc., St. Petersburg, FL (US);

Inventors:

Mark Tudman, St. Petersburg, FL (US);

Rayce Loftin, St. Petersburg, FL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); B05B 13/04 (2006.01); F24H 3/02 (2022.01); H05B 1/02 (2006.01); H05B 6/10 (2006.01); H05B 6/44 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0469 (2013.01); B05B 13/0431 (2013.01); B05B 13/0447 (2013.01); F24H 3/022 (2013.01); H05B 1/023 (2013.01); H05B 6/10 (2013.01); H05B 6/44 (2013.01);
Abstract

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.


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