The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Jun. 13, 2022
Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Dong Pil Park, Incheon, KR;

Byung Jin Choi, Incheon, KR;

Na Yeon Kim, Seoul, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jeollabuk-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0281 (2013.01); H05K 1/189 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A printed circuit board according to an embodiment of the present invention includes a core layer and a circuit wiring layer disposed on a top surface of the core layer. The core layer is spaced apart from the circuit wiring layer and includes through-holes formed around the circuit wiring layer. Flexibility of the printed circuit board may be enhanced by the through-hole to obtain bending stability.


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