The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Mar. 29, 2021
Applicant:

Lumentum Japan, Inc., Sagamihara, JP;

Inventor:

Koichiro Adachi, Tokyo, JP;

Assignee:

Lumentum Japan, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H01P 3/081 (2013.01); H05K 1/0219 (2013.01); H05K 1/0245 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/097 (2013.01); H05K 2201/09727 (2013.01);
Abstract

A differential circuit board includes a dielectric layer having a first and a second surface, a first conductor line with a first line-width, a second conductor line with a second line-width less than the first line-width, and a ground conductor. The dielectric layer has a first portion with a first thickness between the first and second surface and a second portion with a second thickness less than the first thickness between the first and second surfaces. The first conductor line is disposed on the first surface of the first portion. The second conductor line is disposed on the first surface of the second portion. The ground conductor is disposed on the second surface of the first portion and the second surface of the second portion, wherein the ground conductor overlaps with the first conductor line and the second conductor line. The first and second conductor lines are differential transmission lines.


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