The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Sep. 16, 2021
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

John Martinis, Santa Barbara, CA (US);

Xiaojun Trent Huang, Santa Barbara, CA (US);

Bob Benjamin Buckley, Santa Barbara, CA (US);

Assignee:

GOOGLE LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06N 10/00 (2022.01); H03K 5/01 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); G06N 10/00 (2019.01); H03K 5/01 (2013.01); H05K 1/028 (2013.01); H05K 1/09 (2013.01); H05K 1/116 (2013.01); H05K 3/06 (2013.01); H05K 3/188 (2013.01); H05K 2201/0154 (2013.01);
Abstract

A flex circuit board can be used in transmitting signals in a quantum computing system. The flex circuit board can include at least one dielectric layer and at least one superconducting layer disposed on a surface of the at least one dielectric layer. The at least one superconducting layer can include a superconducting material. The superconducting material can be superconducting at a temperature less than about 3 kelvin. The flex circuit board can have at least one metal structure electroplated onto the at least one superconducting layer.


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