The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Apr. 14, 2022
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventors:

John Dickey, Caledonia, IL (US);

Kevin Kilroy, Gilbert, IL (US);

Assignee:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); H05K 1/021 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 3/107 (2013.01); H05K 2201/0302 (2013.01); H05K 2201/032 (2013.01); H05K 2201/10166 (2013.01);
Abstract

Circuit board assemblies include a circuit board portion having a recess formed therein, an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion, an electrically and thermally conductive layer adapted and configured to interface with an external chassis, and a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.


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