The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Dec. 05, 2019
Applicant:

Schneider Electric Systems Usa, Inc., Foxborough, MA (US);

Inventors:

Philip George Hunt, Bedford, MA (US);

Mark V. Bertolina, Milton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 9/06 (2006.01); G05B 19/042 (2006.01); G05B 23/02 (2006.01); G06F 8/65 (2018.01); G06T 19/00 (2011.01); H04L 9/40 (2022.01); H04W 4/38 (2018.01); H04W 12/03 (2021.01); G06F 21/60 (2013.01); H04L 9/12 (2006.01); H04L 9/14 (2006.01); H04L 9/16 (2006.01);
U.S. Cl.
CPC ...
H04L 9/0656 (2013.01); G05B 19/0425 (2013.01); G05B 23/0283 (2013.01); G06F 8/65 (2013.01); G06T 19/006 (2013.01); H04L 63/107 (2013.01); H04W 4/38 (2018.02); H04W 12/03 (2021.01); G06F 21/60 (2013.01); G06F 21/602 (2013.01); H04L 9/12 (2013.01); H04L 9/14 (2013.01); H04L 9/16 (2013.01); H04L 2209/805 (2013.01);
Abstract

Methods and systems for implementing one-time pad (OTP) encryption in industrial wireless instruments advantageously make use of data storage devices now available that can store a large number of encryption keys or pads in a small enough package to fit within an industrial wireless instrument. In some embodiments, the wireless instruments use solid-state memory devices that can easily hold a sufficient number of pads to last the expected lifetime of the wireless instruments. The solid-state memory devices are installed only during manufacturing of the wireless instruments where tamper-resistant manufacturing and assembly techniques may be used to ensure security for the pads. Likewise, the solid-state memory devices of the wireless instruments are also replaced or replenished only at an authorized manufacturer should additional pads be needed.


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