The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Jan. 06, 2023
Applicant:

Acacia Communications, Inc., Maynard, MA (US);

Inventors:

Long Chen, Marlboro, NJ (US);

Leonard Jan-Peter Ketelsen, Clinton, NJ (US);

Assignee:

ACACIA TECHNOLOGY, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/026 (2006.01); G02B 6/12 (2006.01); G02B 6/13 (2006.01); H04B 10/032 (2013.01); H04B 10/25 (2013.01); H04B 10/50 (2013.01); H04J 14/02 (2006.01);
U.S. Cl.
CPC ...
H04B 10/50 (2013.01); H04B 10/032 (2013.01); H04B 10/25 (2013.01); H04J 14/0254 (2013.01); G02B 6/12 (2013.01); G02B 6/13 (2013.01); H01S 5/0261 (2013.01); H01S 5/0262 (2013.01); H01S 5/0265 (2013.01);
Abstract

Aspects of the present disclosure are directed to a photonic integrated circuit (PIC) having a resistivity-engineered substrate to suppress radio-frequency (RF) common-mode signals. In some embodiments, a semiconductor substrate is provided that comprises two portions having different levels of resistivity to provide both suppression of common mode signals, and reduction of RF absorption loss for non-common mode RF signals. In such embodiments, a bottom portion of the semiconductor substrate has a low resistivity to suppress common mode via RF absorption, while a top portion of the semiconductor substrate that is adjacent to conductors in the IC has a high resistivity to reduce RF loss.


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