The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Jun. 13, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Juan Alejandro Herbsommer, Allen, TX (US);

Nikita Mahjabeen, Richardson, TX (US);

Hassan Omar Ali, Murphy, TX (US);

Meysam Moallem, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03L 7/26 (2006.01); G01N 29/44 (2006.01); G04F 5/14 (2006.01); G06F 1/12 (2006.01); H01P 3/00 (2006.01); H01P 3/12 (2006.01); H01P 5/107 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 13/18 (2006.01); H03L 7/06 (2006.01); H04B 1/40 (2015.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H03L 7/26 (2013.01); G01N 29/44 (2013.01); G04F 5/145 (2013.01); G06F 1/12 (2013.01); H01P 3/003 (2013.01); H01P 3/006 (2013.01); H01P 3/121 (2013.01); H01P 5/107 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 13/18 (2013.01); H03L 7/06 (2013.01); H04B 1/40 (2013.01); H05K 1/0243 (2013.01);
Abstract

In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.


Find Patent Forward Citations

Loading…