The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Mar. 23, 2022
Applicant:

Hangzhou Mo-link Technology Co. Ltd, Hangzhou, CN;

Inventors:

Cheng Zhi Mo, Hangzhou, CN;

Qi Chen, Hangzhou, CN;

Hao Wang, Hangzhou, CN;

Fengfeng Yang, Hangzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/66 (2006.01); G02B 6/42 (2006.01); H01R 13/50 (2006.01); H01R 13/6581 (2011.01); H01R 43/18 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6691 (2013.01); G02B 6/425 (2013.01); H01R 13/50 (2013.01); H01R 13/6581 (2013.01); H01R 43/18 (2013.01); G02B 6/423 (2013.01); G02B 6/4246 (2013.01); G02B 6/4249 (2013.01); G02B 6/428 (2013.01); H01R 13/665 (2013.01); H01R 13/6658 (2013.01); H05K 2201/10121 (2013.01);
Abstract

The present disclosure describes a signal transmission device based on molded interconnect device and laser direct structuring (MID/LDS) technology, comprising: a shielding shell (); and a photoelectric conversion module (), which includes a carrier (), an electrical module () and an optical module (). The photoelectric conversion module () is fixed inside the shielding shell (), wherein the first recessed structure () accommodates a driving chip (), a photoelectric conversion chip () and an optical module (), and the second recessed structure () accommodates an electrical module (), the driving chip (), the photoelectric conversion chip () and the conductive terminal () are electrically connected to each other, and the carrier () is designed by integral molding based on the MID/LDS technology. In t present disclosure, the design space in the shielding shell can be effectively saved.


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