The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Mar. 17, 2023
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Fabian Kopp, Penang, MY;

Attila Molnar, Penang, MY;

Bjoern Muermann, Regensburg, DE;

Franz Eberhard, Regensburg, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/46 (2010.01); H01L 33/14 (2010.01); H01L 33/20 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 33/42 (2010.01); H01L 33/44 (2010.01); H01L 33/62 (2010.01); H01L 33/08 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/14 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/46 (2013.01); H01L 33/62 (2013.01); H01L 33/08 (2013.01); H01L 33/38 (2013.01); H01L 33/42 (2013.01);
Abstract

In an embodiment a radiation-emitting semiconductor chip includes a semiconductor body having an active region configured to generate radiation, a first contact layer having a first contact area and a first contact finger structure connected to the first contact area, a second contact layer having a second contact area and a second contact finger structure connected to the second contact area, a current distribution layer electrically conductively connected to the first contact layer, a connection layer electrically conductively connected to the first contact layer via the current distribution layer and an insulation layer, wherein the insulation layer is arranged in places between the connection layer and the current distribution layer, wherein the insulation layer has at a plurality of openings, in which the connection layer and the current distribution layer adjoin one another, and wherein edge regions of the insulation layer includes more openings than a central region of the insulation layer.


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