The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Oct. 20, 2021
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Youhei Oda, Kariya, JP;

Kouichi Sawada, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 29/1095 (2013.01); H01L 29/407 (2013.01); H01L 29/66734 (2013.01);
Abstract

A semiconductor device includes a semiconductor switching element having a drift layer, a body region, a first impurity region, trench gate structures, a high impurity concentration layer, an interlayer insulation film, an upper electrode and a lower electrode. The body region is arranged on the drift layer. The first impurity region is arranged in a surface portion of the body region in the body region and has an impurity concentration higher than the drift layer. Each of the trench gate structures includes a trench. A shield electrode, an intermediate insulation film and a gate electrode layer are stacked through an insulation film in the trench. The high impurity concentration layer is arranged on a side opposite to the body region to sandwich the drift layer between the high impurity concentration layer and the body region. The interlayer insulation film is arranged on the trench gate structures.


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