The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Dec. 09, 2021
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Chih-Yen Chen, Hsinchu, TW;

Franky Juanda Lumbantoruan, Taoyuan, TW;

Tuan-Wei Wang, New Taipei, TW;

Juin-Yang Chen, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/205 (2006.01); H01L 29/267 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/205 (2013.01); H01L 29/267 (2013.01); H01L 29/15 (2013.01); H01L 29/2003 (2013.01); H01L 29/7786 (2013.01);
Abstract

A semiconductor structure includes a substrate, a buffer layer, a channel layer, a barrier layer, a doped compound semiconductor layer, and a composite blocking layer. The buffer layer is on the substrate. The channel layer is on the buffer layer. The barrier layer is on the channel layer. The doped compound semiconductor layer is on the barrier layer. The composite blocking layer is on the doped compound semiconductor layer, the composite blocking layer and the barrier layer include the same Group III element, and the atomic percent of the same Group III element in the composite blocking layer increases with the distance from the doped compound semiconductor layer.


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