The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Aug. 05, 2019
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Yuki Nakano, Kyoto, JP;

Masatoshi Aketa, Kyoto, JP;

Takui Sakaguchi, Kyoto, JP;

Yuichiro Nanen, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0696 (2013.01); H01L 29/045 (2013.01); H01L 29/086 (2013.01); H01L 29/1608 (2013.01); H01L 29/7805 (2013.01); H01L 29/7806 (2013.01); H01L 29/7813 (2013.01);
Abstract

An SiC semiconductor device includes an SiC semiconductor layer having a first main surface and a second main surface, a gate electrode embedded in a trench with a gate insulating layer, a source region of a first conductivity type formed in a side of the trench in a surface laver portion of the first main surface, a body region of a second conductivity type formed in a region at the second main surface side with respect to the source region in the surface layer portion of the first main surface, a drift region of the first conductivity type formed in a region at the second main surface side in the SiC semiconductor layer, and a contact region of the second conductivity type having an impurity concentration of not more than 1.0×10cmand formed in the surface layer portion of the first main surface.


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